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Toshiba Electronics Europe GmbH announced that Toshiba<\/a> Electronic Devices & Storage Corporation (Toshiba) has become the first in the storage industry to verify 12-disk stacking technology for high-capacity hard disk<\/a> drives (HDDs).<\/p>\n\n\n\n The company revealed that, by combining this achievement with Microwave-Assisted Magnetic Recording (MAMR) technology, it aims to introduce 40TB-class 3.5-inch HDDs for data centers by 2027.<\/p>\n\n\n\n This 12-disk stacking technology uses advanced design and analysis developed by Toshiba to create thinner and more compact products. It adds two disks to the standard 10-disk, 3.5-inch structure used in Toshiba\u2019s nearline HDDs.<\/p>\n\n\n\n Key advancements include: These innovations enhance mechanical stability, improve in-plane accuracy, increase density, and boost overall reliability.<\/p>\n\n\n\n As data generation continues to surge with the rise of cloud services, streaming platforms, generative AI, and data science, Toshiba is working to expand storage capacities.<\/p>\n\n\n\n The company is also investigating the use of 12-disk stacking with next-generation Heat Assisted Magnetic Recording (HAMR) technology. The goal is to deliver higher-capacity HDDs that meet growing data center demands while reducing total cost of ownership (TCO) for customers.<\/p>\n\n\n\n Toshiba\u2019s 12-disk stacking technology will be showcased at the IDEMA Symposium on October 17, 2025, in Kawasaki, Japan.<\/p>\n\n\n\n <\/p>\n","protected":false},"excerpt":{"rendered":" Toshiba Electronics Europe GmbH announced that Toshiba Electronic Devices & […]<\/p>\n","protected":false},"author":58,"featured_media":102505,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"inline_featured_image":false,"_monsterinsights_skip_tracking":false,"_monsterinsights_sitenote_active":false,"_monsterinsights_sitenote_note":"","_monsterinsights_sitenote_category":0,"footnotes":""},"categories":[9621,10388],"tags":[1051],"contributor":[9732],"class_list":["post-102500","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-emerging-technologies","category-storage","tag-vendors","contributor-news-desk"],"featured_image_src":"https:\/\/techxmedia.com\/en\/wp-content\/uploads\/2025\/10\/Toshiba-Electronics-21.jpg","author_info":{"display_name":"Lubna","author_link":"https:\/\/techxmedia.com\/en\/author\/lubna\/"},"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/techxmedia.com\/en\/wp-json\/wp\/v2\/posts\/102500","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/techxmedia.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/techxmedia.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/techxmedia.com\/en\/wp-json\/wp\/v2\/users\/58"}],"replies":[{"embeddable":true,"href":"https:\/\/techxmedia.com\/en\/wp-json\/wp\/v2\/comments?post=102500"}],"version-history":[{"count":1,"href":"https:\/\/techxmedia.com\/en\/wp-json\/wp\/v2\/posts\/102500\/revisions"}],"predecessor-version":[{"id":102501,"href":"https:\/\/techxmedia.com\/en\/wp-json\/wp\/v2\/posts\/102500\/revisions\/102501"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/techxmedia.com\/en\/wp-json\/wp\/v2\/media\/102505"}],"wp:attachment":[{"href":"https:\/\/techxmedia.com\/en\/wp-json\/wp\/v2\/media?parent=102500"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/techxmedia.com\/en\/wp-json\/wp\/v2\/categories?post=102500"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/techxmedia.com\/en\/wp-json\/wp\/v2\/tags?post=102500"},{"taxonomy":"contributor","embeddable":true,"href":"https:\/\/techxmedia.com\/en\/wp-json\/wp\/v2\/contributor?post=102500"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}
\u2022 Development of new dedicated parts in the stack
\u2022 Replacement of aluminum substrate with a glass substrate for greater durability and thinner designs<\/p>\n\n\n\n