Lenovo announced the ThinkEdge SE70, a powerful and versatile artificial intelligence (AI) edge platform for enterprises, at its annual TechWorld event. The ThinkEdge SE70 is intended to address the growing need for intelligent transformation in industries ranging from logistics, transportation, and smart cities to retail, healthcare, and manufacturing. Lenovo’s new edge solution was developed in collaboration with Amazon Web Services (AWS) and is powered by the NVIDIA® JetsonTMXavierTM NX platform.
Making the Edge Smarter
As businesses intelligently alter operations and services with increasingly powerful analytics and automation capabilities, edge AI computing applications are diverse and rising rapidly. According to IDC, by 2023, 70% of Internet of Things (IoT) deployments will integrate AI solutions for autonomous or edge decision making, enabling enterprises to achieve their operational and strategic goals.
Security, safety, industrial quality control, and improving retail experiences are among the major use cases for computer vision (CV), which is one of the fastest developing edge AI applications. According to a recent IDG poll, 96% of respondents feel CV has the ability to increase revenue, 96% of respondents believe CV has the potential to boost revenue, while 97% said the technology will save their organization time and money.
The ThinkEdge SE70 was designed specifically to help businesses harness the power of CV apps. The AWS Panorama Device SDK will be pre-installed on a version of the ThinkEdge SE70, allowing enterprise clients to turn ordinary IP cameras into “smart” cameras that run CV programmes at the edge. To increase insight into potential vulnerabilities, AWS Panorama allows actions that previously required human inspection to be automated. AWS Panorama, for example, can be used to track assets for improving facility operations and monitoring inventory levels on retail shelves–even in low-bandwidth environments.
NVIDIA Jetson Xavier NX is a production-ready, high-performance, small form factor, power-efficient system on a cloud-managed module for enhanced security and ease of training and deploying various AI and machine learning models to the edge, powers the new ThinkEdge AI-capable edge appliance. It can handle data from many high-resolution sensors at up to 21 trillion operations per second (TOPS). It also operates sophisticated neural networks in parallel. NVIDIA CUDA-XTM, a comprehensive AI software stack with highly optimised, domain-specific libraries that lowers complexity and accelerates time to market, is used by Jetson Xavier NX.
The ThinkEdge SE70’s durable architecture, paired with its high processing power and versatile configurations, positions it as vital infrastructure for smart networks that allow real-time decision making in emerging hybrid business models with sophisticated automation.
“AI applications at the edge have enormous potential for the intelligent transformation of business, like using computer vision to track warehousing and logistics operations or automating manufacturing processes,” said Jon Pershke, Vice President of Strategy and Emerging Business for Lenovo’s Intelligent Devices Group.
Also said, “The ThinkEdge portfolio is expanding to include the power, performance and flexibility customers need to build next-level edge networks”.
“We are excited to be working with Lenovo and NVIDIA, two market leaders in edge technology,” said Ankur Mehrotra, Director, AWS AI.
Further added, “This new product brings together strong GPU performance from NVIDIA, hardware system expertise from Lenovo, and scalable computer vision from AWS into a cost-effective and competitive package that customers can use to solve business challenges across many use cases.”
Key Features / Specs
The ThinkEdge SE70 is a versatile edge platform with some of the most powerful AI performance and reliability.
|AI Power||CPU: 6-core NVIDIA Carmel Arm®v8.2 64-bit CPU|
GPU: 384-core NVIDIA Volta™ GPU, 48 Tensor Cores
Performance: 21 TOPS (INT8)
Configurable up to 8 POE
|Form Factor||Fan-less, operational temperature range up to -20 to 60|
|Single Design Base|
with 2 Form Factors
|General form factor.|
Expanded form factor with multiple POE and power