BIWIN announced the debut of its advanced Industrial BGA SSD, a new storage innovation designed for the evolving AIoT and edge intelligence landscape. The new-generation BGA SSD combines an ultra-compact design with strong computing efficiency, offering up to 1 TB capacity and PCIe Gen4x4 performance in a 16.0 × 20.0 × 1.3 mm form factor.

The company reported that the BIWIN Industrial BGA SSD is built for mission-critical devices requiring low latency, high endurance, and stable operation in extreme industrial and automotive environments.

Key features include:

• Wide-temperature support from -40°C to 105°C
• Self-developed firmware and advanced LDPC error correction
• Ultra-fast boot algorithms for improved responsiveness

BIWIN revealed that the BGA SSD is optimized for applications such as smart vehicles, industrial control, AI smart boxes, high-load edge computing devices, and next-generation autonomous systems.

The compact BGA packaging significantly reduces PCB footprint, with a reported 94.09% volume reduction compared to standard 2280 SSDs. It also delivers efficient power use and long-term durability under demanding conditions, making the BIWIN Industrial BGA SSD suitable for a wide range of industrial and edge computing scenarios.

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